封装规格
- 31-QFN(5x5)
- 39-QFN(5x6)
- DIP23
- MODULE
- 22-PowerVFQFN 模块
- 22-QFN(4.5x3.5)
- 31-PowerVFQFN 模块
- PowerDIP Module25
- SPM-5
- -
- 25-PowerDIP 模块(0.993,25.23mm)
- 26-PowerSMD 模块,鸥翼
- 28-SOIC(0.295,7.50mm 宽),19 引线
- 30-QFN(5x5)
- DIP
- DIP Module23
- DIP-27H
- MDIP30
- MSIP22
- Module
- PowerDIP Module23
- QFN12X1227L
- QFN5050
- SIP29
- SOP23
- ZIP18/22