封装
- -
- 14-TSSOP(0.173",4.40mm 宽)
- 16-LSSOP(0.173",4.40mm 宽)
- 16-SOIC(0.295",7.50mm 宽)
- 20-SOIC(0.295",7.50mm 宽)
- 20-SSOP(0.209",5.30mm 宽)
- 20-TSSOP(0.173",4.40mm 宽)
- 24-SOIC(0.295",7.50mm 宽)
- 25-FLGA
- 27 Flexiwatt(成型引线)
- 28-SOIC(0.295",7.50mm 宽)
- 28-SSOP(0.209",5.30mm 宽)
- 28-TSSOP(0.173",4.40mm 宽)
- 28-VFQFN 裸露焊盘
- 32-WFQFN 裸露焊盘,CSP
- 36-UFBGA,WLCSP
- 44-LQFP
- 48-LQFP
- 48-TQFP
- 48-VFQFN 裸露焊盘
- 6-XFBGA,CSPBGA
- 64-LQFP
- 64-LQFP 裸露焊盘
- 64-TQFP
- 8-SOIC(0.154",3.90mm 宽)
- 9-UFBGA,WLCSP
- LFCSP-SS-32_5x5mm
- PowerSO-36 裸露顶部焊盘
- SOIC-28-300mil
- SOP28
- SQFP-64
- SSOP-20
- SSOP-28
- TQFP-128
- TSSOP-28
- UCSP35L1