品牌
封装
- -
- 10-WFDFN 裸露焊盘
- 12-TSSOP(0.118",3.00mm 宽)裸露焊盘
- 14-SOIC(0.173",4.40mm 宽)
- 14-TSSOP(0.173",4.40mm 宽)裸露焊盘
- 16-LSSOP(0.173",4.40mm 宽)
- 16-SSIP,13 引线,裸露焊盘,成形引线
- 16-TSSOP(0.173",4.40mm 宽)裸露焊盘
- 16-UFQFN 裸露焊盘
- 18-VFQFN 裸露焊盘
- 20-SOIC(0.433",11.00mm 宽)裸露焊盘
- 20-TSSOP(0.173",4.40mm 宽)
- 21-PowerWFQFN
- 23-PowerVFQFN
- 24-VQFN 裸露焊盘
- 24-WFQFN 裸露焊盘
- 25-PowerWFQFN
- 27-PowerTFQFN
- 27-PowerVFLGA
- 28-SOIC(0.295",7.50mm 宽)
- 28-SOP(0.295",7.50mm 宽)+ 2 热凸片
- 29-PowerWFQFN
- 29-SSIP 模块,21 引线,成型引线
- 32-PowerDIP 模块,23 引线
- 32-PowerWFQFN
- 35-PowerVFLGA
- 39-PowerWFQFN
- 40-VFQFN 裸露焊盘
- 41-PowerVFLGA
- 52-VQFN 裸露焊盘
- 56-VFQFN 裸露焊盘
- 8-SOIC(0.173",4.40mm 宽)
- 8-UFDFN 裸露焊盘
- DIP-23
- DIP_S3-24
- HSOP-28
- LQFP-100(14x14)
- MFP-10SK
- MFP-14
- MFP-14S
- Micro8
- PG-TO263-7
- PowerPAK® MLP66-40
- SIP-29
- SOIC-10_150mil
- SOIC-14
- SOP-23
- SSOP32
- TO-263-8,D²Pak(7 引线+接片),TO-263CA
- TO263-7
- TQFN-24(4x4)
- TQFN-32(5x5)
- TSSOP-16
- TSSOP-28
- 模块
应用
导通电阻(典型值)
电流-输出/通道
电流-峰值输出
电压-供电
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- 1.62V~3.63V
- 1.8V,2.5V,3.3V
- 11.4V~15V
- 11.5V~20V
- 12.5V~17.5V
- 13.5V~16.5V
- 2.2V~16V
- 2.5V~9V
- 2.7V~3.6V
- 2.7V~5.5V
- 3.5V~15V
- 3V,5V
- 3V~16V
- 3V~3.6V
- 4,75V~40V
- 4.3V~13.2V
- 4.5V~15V
- 4.5V~16V
- 4.5V~40V
- 4.5V~5.5V
- 4.5V~7V
- 4.75V~5.25V
- 4V~16V
- 5.5V~36V
- 5.5V~40V
- 5V~14V
- 5V~28V
- 5V~36V
- 5V~40V
- 6.4V~7V
- 6V~14V
- 6V~40V
- 7.5V~18V
- 7V~7.8V