品牌
封装规格
- DIP-23
- SOP-23
- 32-SOIC
- 41-PowerVFLGA
- PG-TO263-7
- 41-LGA(5x6)
- 41-TLGA(5x6)
- DIP-16
- SOIC20
- -
- 12-MSOP-EP
- 28-SOIC(0.295,7.50mm 宽)
- EMP-24
- MFP-14
- SOIC-10_150mil
- 16-QFN(3x3)
- 16-UFQFN 裸露焊盘
- 23-TQFN(3x6)
- 27-LGA(4x5)
- 27-PowerVFLGA
- 27-TLGA(4x5)
- 35-TLGA(3x6)
- CDIP16
- ISOLATED PACKAGE-25
- LGA-41(5x6)
- PLCC28
- SIP-29
- SOIC24
- SOP24
- SSIP-29
- SSOP24
- TSSOP-16
- TSSOP-28
- ZIP19
- 模块
- 10-SOP
- 10-TDFN(3x3)
- 10-WFDFN 裸露焊盘
- 12-TSSOP(0.118,3.00mm 宽)裸露焊盘
- 14-TSSOP-EP
- 16-eTSSOP-EP
- 20-SSO
- 21-PowerWFQFN
- 23-DIP
- 23-PowerVFQFN
- 24-QFN(4x4)
- 24-WFQFN 裸露焊盘
- 25-PowerWFQFN
- 27-QFN(4x5)
- 28-SOP
- 29-FC-TQFN(4x6)
- 29-SIP
- 29-SSIP 模块,21 引线,成型引线
- 32-PowerDIP 模块,23 引线
- 35-PowerVFLGA
- 38-DIP 模块,24 引线
- 52-VQFN(12x12)
- 56-HVQFN(8x8)
- BSSOP-32-300mil
- CDIP14
- DIP16
- DIP28
- DIP8
- DIP_S3-24
- EMP-20
- EMP16
- EMP24
- HDIP-30
- HSOP-28
- HSOP-28-300mil
- HTSSOP44
- LDCC20
- LQFP-100(14x14)
- LSOP-14-175mil
- MFP-10SK
- MFP-14S
- Micro8
- Module
- PDIP18
- PDIP20
- PG-TO263-7-1
- QFN40
- SIP-19
- SOIC-10-1mm
- SOIC-14
- SOIC28
- SOLCC6
- SOP-28-300mil
- SOP34
- SOT-1762-1
- SSOP32
- TQFN
- TQFN-24(4x4)
- TQFN-32(5x5)
- TQFP48
- TSSOP16
- UQFN16
- VQFN-52
- ZIP29
- eSIP-16K
- 插件