品牌
封装规格
- -
- U-QFN1418-10
- SOT-23-5
- SC70-6
- 10-VSON(3x3)
- 10-DFN-EP(3x3)
- 10-WFDFN 裸露焊盘
- 10-微型
- 8-SOIC
- SOT-143R
- 20-LSSOP(0.173,4.40mm 宽)
- SOT-363
- TSSOP8
- 10-DFN(3x3)
- 10-MSOP
- 10-TQFN(2x3)
- 32-LGA(5x5)
- 8-DSBGA(0.71x1.47)
- HVQFN64
- SOIC8
- TSOT-23-8
- 10-DFN(2x2)
- 10-VQFN-HR(2x2)
- 16-QFN(2.5x3.2)
- 16-VFQFN 裸露焊盘
- 20-SSOP-B
- 20-TQFN-EP(4x4)
- 24-TQFN(4x4)
- 4-DSBGA(1x1)
- 8-MSOP
- 8-MiniSO
- 8-VSSOP
- DSBGA4
- PG-SOT-143R-3D
- PG-SOT143-4
- SC-70-5
- SOIC-8
- SOLCC6
- SOP14
- SOT-23-3
- SOT-23-THN (DDF)-8
- SOT-23-THN(DDF)|8
- SOT-6
- SOT23-5
- SOT23-6
- SOT886
- TDFN8
- TFBGA64
- TO-236-3,SC-59,SOT-23-3
- TQFN-20-EP(4x4)
- TSOP5/6
- TSOT-23-5
- TSSOP14
- VQFN-10
- VSSOP (DGK)-8