品牌
封装规格
- SIP
- -
- 模块
- Through Hole
- SID
- 32-PQFN(5x5)
- 导轨安装
- PQFN-32(5x5)
- CLGA-203
- DIP-21
- Module30
- 18-SMD 模块
- 203-LCCC(40.64x31.75)
- 57-CLGA(18.2x7)
- 80-LCCC(20.7x9.1)
- 9-USIP
- CLGA-355
- CLGA-54
- CLGA-80
- CPGA-149
- DIP,32x20mm
- DIP-14
- DIP-17
- F5 MicroCan
- Module
- Others
- PQFN-32
- SIP-9
- SMD,14x14mm
- SPDT
- TO263-3
- TSSOP48
- uSIP9
- 插件,25x23mm
- -